Customization: | Available |
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LED Packaging Type: | Chip |
Chip Material: | InGaN |
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Parameter | Symbol | Min. | Typ. | Max. | Unit | Test conditions |
Forward Voltage | VF | 1.6 | 1.8 | 2.2 | V | IF=700mA |
Luminous power | PO | 2000 | --- | 3200 | mW | IF=700mA |
Dominant Wavelength | λd | 800 | 805 | 810 | nm | IF=700mA |
Reverse Current | IR | -- | -- | 10 | uA | VR = 5V |
50% Viewing Angle | 2θ½ | -- | 120 | deg | IF=700mA | |
Recommend Forward Current |
IF(rec) | 700 | mA |
Parameter | Symbol | Value | Unit |
Continuous Forward Current | IF | 700 | mA |
Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) |
IFp | 1000 | mA |
Reverse Voltage | VR | 5 | V |
Power dissipation | Pd | 12 | W |
Electrostatic Discharge | ESD | 1000 | V |
Operating temperature range | Topr | -25~+80 | ºC |
Storage temperature range | Tstg | -35 ~+100 | ºC |
Lead Soldering Temperature | Tsol | 260 | ºC |